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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
04-7533-10CONN SOCKET SIP 4POS TIN |
2,031 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
04-7550-10CONN SOCKET SIP 4POS TIN |
3,330 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
04-7560-10CONN SOCKET SIP 4POS TIN |
2,557 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
04-7700-10CONN SOCKET SIP 4POS TIN |
3,796 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
04-7755-10CONN SOCKET SIP 4POS TIN |
3,308 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
04-7800-10CONN SOCKET SIP 4POS TIN |
3,150 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
04-7850-10CONN SOCKET SIP 4POS TIN |
3,830 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
04-7950-10CONN SOCKET SIP 4POS TIN |
4,696 |
|
Datasheet |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 4 (1 x 4) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
115-83-952-41-001101CONN IC DIP SOCKET 52POS GOLD |
3,991 |
|
- |
115 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
HLS-0303-G-11.100" SCREW MACHINE SOCKET ARRAY |
3,865 |
|
Datasheet |
HLS | Tube | Active | SIP | 9 (3 x 3) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
22-16-2CONN SOCKET TRANSIST 3POS GOLD |
2,354 |
|
Datasheet |
22 | Bulk | Obsolete | Transistor | 3 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | - | Gold | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
22-16-3CONN SOCKET TRANSIST 3POS GOLD |
4,175 |
|
Datasheet |
22 | Bulk | Obsolete | Transistor | 3 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | - | Gold | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
510-83-081-09-000101CONN SOCKET PGA 81POS GOLD |
2,810 |
|
Datasheet |
510 | Bulk | Active | PGA | 81 (9 x 9) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
510-83-081-12-071101CONN SOCKET PGA 81POS GOLD |
2,528 |
|
Datasheet |
510 | Bulk | Active | PGA | 81 (12 x 12) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
117-83-640-41-105101CONN IC DIP SOCKET 40POS GOLD |
2,208 |
|
Datasheet |
117 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
524-AG10D-ESCONN IC DIP SOCKET 24POS GOLD |
4,460 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | - | - | Brass |
|
|
ICO-322-SST.100" LOW PROFILE SCREW MACHINE |
4,671 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | - | Brass |
|
|
146-83-432-41-035101CONN IC DIP SOCKET 32POS GOLD |
4,976 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
40-6513-1040 POS LOW PROF SOCK SERIES 513 |
2,864 |
|
- |
513 | - | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
14-C195-11CONN IC DIP SOCKET 14POS GOLD |
3,394 |
|
Datasheet |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
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