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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    146-87-640-41-036101

    146-87-640-41-036101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    		 3,816
    RFQ
    		146-87-640-41-036101

    Datasheet

         		146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0115-T-2

    HLS-0115-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,612
    RFQ
    		HLS-0115-T-2

    Datasheet

         		HLS Tube Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    36-6513-10T

    36-6513-10T

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 4,612
    RFQ
    		36-6513-10T

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0107-G-12

    HLS-0107-G-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,222
    RFQ
    		HLS-0107-G-12

    Datasheet

         		HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    14-3511-11

    14-3511-11

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 2,275
    RFQ
    		14-3511-11

    Datasheet

         		511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    14-3511-11WR

    14-3511-11WR

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 2,712
    RFQ
    		14-3511-11WR

    Datasheet

         		511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    ICA-314-WGT-3

    ICA-314-WGT-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 4,733
    RFQ
    		ICA-314-WGT-3

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    APO-314-G-J

    APO-314-G-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,530
    RFQ
    		APO-314-G-J

    Datasheet

         		APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    116-87-636-41-009101

    116-87-636-41-009101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    		 3,447
    RFQ
    		116-87-636-41-009101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-308-ZNGG

    ICO-308-ZNGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 4,650
    RFQ
    		ICO-308-ZNGG

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-SGT-L

    ICA-320-SGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 4,904
    RFQ
    		ICA-320-SGT-L

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-83-650-41-001101

    614-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 2,571
    RFQ
    		614-83-650-41-001101

    Datasheet

         		614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0120-S-2

    HLS-0120-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,143
    RFQ
    		HLS-0120-S-2

    Datasheet

         		HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    18-6511-10

    18-6511-10

    SOCKET 18 PIN SOLDER TAIL TIN

    Aries Electronics

    		 4,005
    RFQ

    -

    		 511 - Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    2-1437542-2

    2-1437542-2

    CONN IC DIP SOCKET 18POS GOLD

    TE Connectivity AMP Connectors

    		 2,594
    RFQ
    		2-1437542-2

    Datasheet

         		700 - Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole, Right Angle, Vertical Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Aluminum Alloy -55°C ~ 125°C
    ICF-308-STL-I

    ICF-308-STL-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 4,957
    RFQ
    		ICF-308-STL-I

    Datasheet

         		ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    510-87-144-12-000101

    510-87-144-12-000101

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    		 2,998
    RFQ
    		510-87-144-12-000101

    Datasheet

         		510 Bulk Active PGA 144 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-0511-10

    06-0511-10

    CONN SOCKET SIP 6POS TIN

    Aries Electronics

    		 4,123
    RFQ
    		06-0511-10

    Datasheet

         		511 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-9513-10T

    30-9513-10T

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 3,619
    RFQ
    		30-9513-10T

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    19-0513-11H

    19-0513-11H

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    		 3,726
    RFQ
    		19-0513-11H

    Datasheet

         		0513 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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