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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    32-3513-10

    32-3513-10

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,537
    RFQ
    		32-3513-10

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-084-10-001101

    510-83-084-10-001101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 4,552
    RFQ
    		510-83-084-10-001101

    Datasheet

         		510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-10-031101

    510-83-084-10-031101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 4,148
    RFQ
    		510-83-084-10-031101

    Datasheet

         		510 Bulk Active PGA 84 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-002101

    510-83-084-11-002101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 2,083
    RFQ
    		510-83-084-11-002101

    Datasheet

         		510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-041101

    510-83-084-11-041101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 4,976
    RFQ
    		510-83-084-11-041101

    Datasheet

         		510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-11-042101

    510-83-084-11-042101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 4,628
    RFQ
    		510-83-084-11-042101

    Datasheet

         		510 Bulk Active PGA 84 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-12-051101

    510-83-084-12-051101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 3,213
    RFQ
    		510-83-084-12-051101

    Datasheet

         		510 Bulk Active PGA 84 (12 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-6503-30

    10-6503-30

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,179
    RFQ
    		10-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    124-83-628-41-002101

    124-83-628-41-002101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    		 4,257
    RFQ

    -

    		 124 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    816-AG10D

    816-AG10D

    CONN IC DIP SOCKET 16POS GOLD

    TE Connectivity AMP Connectors

    		 3,748
    RFQ
    		816-AG10D

    Datasheet

         		800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) - - - Polyester -55°C ~ 105°C
    510-83-084-13-081101

    510-83-084-13-081101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 3,969
    RFQ
    		510-83-084-13-081101

    Datasheet

         		510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-084-13-082101

    510-83-084-13-082101

    CONN SOCKET PGA 84POS GOLD

    Preci-Dip

    		 3,601
    RFQ
    		510-83-084-13-082101

    Datasheet

         		510 Bulk Active PGA 84 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-950-41-001101

    614-83-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    		 4,096
    RFQ
    		614-83-950-41-001101

    Datasheet

         		614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    36-1518-11

    36-1518-11

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 4,680
    RFQ
    		36-1518-11

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICF-322-TL-I-TR

    ICF-322-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 3,109
    RFQ
    		ICF-322-TL-I-TR

    Datasheet

         		ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-STL-I-TR

    ICF-322-STL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 2,508
    RFQ
    		ICF-322-STL-I-TR

    Datasheet

         		ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-322-STL-O-TR

    ICF-322-STL-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 4,212
    RFQ
    		ICF-322-STL-O-TR

    Datasheet

         		ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APH-0504-T-R

    APH-0504-T-R

    APH-0504-T-R

    Samtec Inc.

    		 2,534
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1404-T-R

    APH-1404-T-R

    APH-1404-T-R

    Samtec Inc.

    		 4,036
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1004-T-R

    APH-1004-T-R

    APH-1004-T-R

    Samtec Inc.

    		 4,578
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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