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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    08-3501-21

    08-3501-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,701
    RFQ
    		08-3501-21

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-3501-31

    08-3501-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 4,218
    RFQ
    		08-3501-31

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    510-83-085-10-031101

    510-83-085-10-031101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    		 4,987
    RFQ
    		510-83-085-10-031101

    Datasheet

         		510 Bulk Active PGA 85 (10 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-085-11-001101

    510-83-085-11-001101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    		 4,279
    RFQ
    		510-83-085-11-001101

    Datasheet

         		510 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-085-11-041101

    510-83-085-11-041101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    		 4,433
    RFQ
    		510-83-085-11-041101

    Datasheet

         		510 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-085-11-044101

    510-83-085-11-044101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    		 4,331
    RFQ
    		510-83-085-11-044101

    Datasheet

         		510 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-085-11-045101

    510-83-085-11-045101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    		 3,353
    RFQ
    		510-83-085-11-045101

    Datasheet

         		510 Bulk Active PGA 85 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-085-13-001101

    510-83-085-13-001101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    		 4,774
    RFQ
    		510-83-085-13-001101

    Datasheet

         		510 Bulk Active PGA 85 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-085-13-042101

    510-83-085-13-042101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    		 2,809
    RFQ
    		510-83-085-13-042101

    Datasheet

         		510 Bulk Active PGA 85 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-085-13-081101

    510-83-085-13-081101

    CONN SOCKET PGA 85POS GOLD

    Preci-Dip

    		 3,727
    RFQ
    		510-83-085-13-081101

    Datasheet

         		510 Bulk Active PGA 85 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-642-41-105101

    117-83-642-41-105101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    		 2,204
    RFQ
    		117-83-642-41-105101

    Datasheet

         		117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-428-41-011101

    116-83-428-41-011101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    		 3,844
    RFQ
    		116-83-428-41-011101

    Datasheet

         		116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    09-0503-20

    09-0503-20

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    		 4,606
    RFQ
    		09-0503-20

    Datasheet

         		0503 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    12-0517-90C

    12-0517-90C

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    		 3,496
    RFQ
    		12-0517-90C

    Datasheet

         		0517 Bulk Active SIP 12 (1 x 12) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-640-41-012101

    116-83-640-41-012101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    		 4,665
    RFQ
    		116-83-640-41-012101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    528-AG10D-ES

    528-AG10D-ES

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    		 4,834
    RFQ
    		528-AG10D-ES

    Datasheet

         		500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass - -55°C ~ 125°C
    28-3518-00

    28-3518-00

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,174
    RFQ
    		28-3518-00

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-3518-10TLH

    28-3518-10TLH

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,373
    RFQ
    		28-3518-10TLH

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-642-41-009101

    116-87-642-41-009101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    		 2,339
    RFQ
    		116-87-642-41-009101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-320-WTT-2

    ICA-320-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 2,580
    RFQ
    		ICA-320-WTT-2

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
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