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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    31-0518-11

    31-0518-11

    CONN SOCKET SIP 31POS GOLD

    Aries Electronics

    4,233
    RFQ
    31-0518-11

    Datasheet

    518 Bulk Active SIP 31 (1 x 31) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    510-87-144-15-001101

    510-87-144-15-001101

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    2,308
    RFQ
    510-87-144-15-001101

    Datasheet

    510 Bulk Active PGA 144 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-87-144-15-081101

    510-87-144-15-081101

    CONN SOCKET PGA 144POS GOLD

    Preci-Dip

    2,844
    RFQ
    510-87-144-15-081101

    Datasheet

    510 Bulk Active PGA 144 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-87-133-13-041101

    510-87-133-13-041101

    CONN SOCKET PGA 133POS GOLD

    Preci-Dip

    2,295
    RFQ
    510-87-133-13-041101

    Datasheet

    510 Bulk Active PGA 133 (13 x 13) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    PGA145H012B1-1521R

    PGA145H012B1-1521R

    PGA SOCKET 145 CTS

    Amphenol ICC (FCI)

    3,945
    RFQ
    PGA145H012B1-1521R

    Datasheet

    - - Active PGA 145 (15 x 15) Gold 10.0µin (0.25µm) - Through Hole Open Frame 0.100" (2.54mm) - - - - - - -
    28-C212-10T

    28-C212-10T

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    4,838
    RFQ
    28-C212-10T

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    08-6822-90C

    08-6822-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,353
    RFQ
    08-6822-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    APO-314-T-C

    APO-314-T-C

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,249
    RFQ
    APO-314-T-C

    Datasheet

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
    ICO-308-ZCGG

    ICO-308-ZCGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,190
    RFQ
    ICO-308-ZCGG

    Datasheet

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
    612-83-650-41-001101

    612-83-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    2,204
    RFQ
    612-83-650-41-001101

    Datasheet

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    614-87-964-41-001101

    614-87-964-41-001101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    2,452
    RFQ
    614-87-964-41-001101

    Datasheet

    614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    08-3508-30

    08-3508-30

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    3,647
    RFQ
    08-3508-30

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    20-0513-11H

    20-0513-11H

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,878
    RFQ
    20-0513-11H

    Datasheet

    0513 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-0513-11

    24-0513-11

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,452
    RFQ
    24-0513-11

    Datasheet

    0513 Bulk Active SIP 24 (1 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    25-0513-11

    25-0513-11

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,623
    RFQ
    25-0513-11

    Datasheet

    0513 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    37-0518-11

    37-0518-11

    CONN SOCKET SIP 37POS GOLD

    Aries Electronics

    3,761
    RFQ
    37-0518-11

    Datasheet

    518 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    614-83-652-41-001101

    614-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,935
    RFQ
    614-83-652-41-001101

    Datasheet

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    5-1437536-2

    5-1437536-2

    CONN IC DIP SOCKET 28POS GOLD

    TE Connectivity AMP Connectors

    4,393
    RFQ
    5-1437536-2

    Datasheet

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - - - Brass
    510-87-145-15-001101

    510-87-145-15-001101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    2,156
    RFQ
    510-87-145-15-001101

    Datasheet

    510 Bulk Active PGA 145 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-87-145-15-002101

    510-87-145-15-002101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    4,608
    RFQ
    510-87-145-15-002101

    Datasheet

    510 Bulk Active PGA 145 (15 x 15) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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