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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-87-145-15-081101CONN SOCKET PGA 145POS GOLD |
2,565 |
|
Datasheet |
510 | Bulk | Active | PGA | 145 (15 x 15) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
HLS-0503-T-2.100" SCREW MACHINE SOCKET ARRAY |
3,004 |
|
Datasheet |
HLS | Bulk | Active | SIP | 15 (5 x 3) | Tin | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | - | Thermoplastic | - | - |
|
|
299-87-324-10-001101CONN IC DIP SOCKET 24POS GOLD |
2,327 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
ICO-318-LGT.100" LOW PROFILE SCREW MACHINE |
3,621 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
916657-3CONN SOCKET PGA ZIF 321POS GOLD |
3,124 |
|
Datasheet |
- | Tray | Obsolete | PGA, ZIF (ZIP) | 321 (19 x 19) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Liquid Crystal Polymer (LCP) | 30.0µin (0.76µm) | Phosphor Bronze |
|
|
146-87-642-41-035101CONN IC DIP SOCKET 42POS GOLD |
2,760 |
|
Datasheet |
146 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
HLS-0113-G-2.100" SCREW MACHINE SOCKET ARRAY |
2,425 |
|
Datasheet |
HLS | Tube | Active | SIP | 13 (1 x 13) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
ICF-316-SM-O.100" SURFACE MOUNT SCREW MACHIN |
4,848 |
|
Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
ICA-422-ZWTT.100" SCREW MACHINE DIP SOCKET |
2,962 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyester, Glass Filled | - | Brass |
|
|
4726SMT SOCKET - WIDE SOIC-8 (200MIL |
4,269 |
|
Datasheet |
- | Bulk | Active | SOIC | 8 (2 x 4) | - | - | - | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | - | - | - | - |
|
|
HLS-0106-G-3.100" SCREW MACHINE SOCKET ARRAY |
4,455 |
|
Datasheet |
HLS | Tube | Active | SIP | 6 (1 x 6) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
|
12-3503-20CONN IC DIP SOCKET 12POS GOLD |
4,468 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
12-3503-30CONN IC DIP SOCKET 12POS GOLD |
3,976 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
20-3518-101CONN IC DIP SOCKET 20POS GOLD |
4,475 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
40-6513-10TCONN IC DIP SOCKET 40POS GOLD |
2,447 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
14-3513-11HCONN IC DIP SOCKET 14POS GOLD |
2,812 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
110-83-964-41-005101CONN IC DIP SOCKET 64POS GOLD |
4,721 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
ICF-640-T-I-TR.100" SURFACE MOUNT SCREW MACHIN |
4,166 |
|
Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
|
116-83-432-41-001101CONN IC DIP SOCKET 32POS GOLD |
4,666 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
510-87-146-15-061101CONN SOCKET PGA 146POS GOLD |
2,830 |
|
Datasheet |
510 | Bulk | Active | PGA | 146 (15 x 15) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
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