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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    26-1518-00

    26-1518-00

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 3,061
    RFQ
    		26-1518-00

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-2820-90C

    08-2820-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 2,223
    RFQ
    		08-2820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-2822-90C

    08-2822-90C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 2,935
    RFQ
    		08-2822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2503-20

    10-2503-20

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,007
    RFQ
    		10-2503-20

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2503-30

    10-2503-30

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,228
    RFQ
    		10-2503-30

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-3503-20

    10-3503-20

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,118
    RFQ
    		10-3503-20

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-3503-30

    10-3503-30

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 2,906
    RFQ
    		10-3503-30

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    XR2A-2201-N

    XR2A-2201-N

    CONN IC DIP SOCKET 22POS GOLD

    Omron Electronics Inc-EMC Div

    		 3,177
    RFQ
    		XR2A-2201-N

    Datasheet

         		XR2 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 29.5µin (0.75µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    510-87-148-15-061101

    510-87-148-15-061101

    CONN SOCKET PGA 148POS GOLD

    Preci-Dip

    		 2,166
    RFQ
    		510-87-148-15-061101

    Datasheet

         		510 Bulk Active PGA 148 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-148-15-062101

    510-87-148-15-062101

    CONN SOCKET PGA 148POS GOLD

    Preci-Dip

    		 2,303
    RFQ
    		510-87-148-15-062101

    Datasheet

         		510 Bulk Active PGA 148 (15 x 15) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-632-MTT

    ICO-632-MTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,014
    RFQ
    		ICO-632-MTT

    Datasheet

         		ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-87-636-41-011101

    116-87-636-41-011101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    		 3,164
    RFQ
    		116-87-636-41-011101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICF-324-F-I

    ICF-324-F-I

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 4,775
    RFQ
    		ICF-324-F-I

    Datasheet

         		ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICA-624-WTT

    ICA-624-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,383
    RFQ
    		ICA-624-WTT

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICF-624-F-O

    ICF-624-F-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    		 3,590
    RFQ
    		ICF-624-F-O

    Datasheet

         		ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    110-83-064-01-505101

    110-83-064-01-505101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    		 2,801
    RFQ
    		110-83-064-01-505101

    Datasheet

         		110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-952-41-001101

    614-83-952-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    		 4,235
    RFQ
    		614-83-952-41-001101

    Datasheet

         		614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    38-1518-11

    38-1518-11

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    		 4,770
    RFQ
    		38-1518-11

    Datasheet

         		518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    299-83-320-10-001101

    299-83-320-10-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    		 3,145
    RFQ
    		299-83-320-10-001101

    Datasheet

         		299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-WGG

    ICA-308-WGG

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 2,415
    RFQ
    		ICA-308-WGG

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
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