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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
22-4518-10MCONN IC DIP SOCKET 22POS GOLD |
4,244 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
612-83-648-41-001101CONN IC DIP SOCKET 48POS GOLD |
3,604 |
|
Datasheet |
612 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
HLS-0120-TT-12.100" SCREW MACHINE SOCKET ARRAY |
3,289 |
|
Datasheet |
HLS | Tube | Active | SIP | 20 (1 x 20) | Tin | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Tin | Thermoplastic | - | - |
|
|
116-87-640-41-002101CONN IC DIP SOCKET 40POS GOLD |
3,633 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
ICO-308-ZMGG.100" LOW PROFILE SCREW MACHINE |
3,296 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
|
116-87-652-41-012101CONN IC DIP SOCKET 52POS GOLD |
3,585 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
ICA-624-SST-L.100" SCREW MACHINE DIP SOCKET |
3,034 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | - | Brass |
|
|
ICA-324-SST-L.100" SCREW MACHINE DIP SOCKET |
2,417 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | - | Brass |
|
|
ICO-324-SST-L.100" LOW PROFILE SCREW MACHINE |
3,984 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | - | Brass |
|
|
14-0517-90CCONN SOCKET SIP 14POS GOLD |
4,666 |
|
Datasheet |
0517 | Bulk | Active | SIP | 14 (1 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | - | Solder | - | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
510-87-145-13-041101CONN SOCKET PGA 145POS GOLD |
3,379 |
|
Datasheet |
510 | Bulk | Active | PGA | 145 (13 x 13) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
12-3513-11HCONN IC DIP SOCKET 12POS GOLD |
3,897 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
30-0518-11CONN SOCKET SIP 30POS GOLD |
4,349 |
|
Datasheet |
518 | Bulk | Active | SIP | 30 (1 x 30) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
APO-318-T-A.100" LOW PROFILE SCREW MACHINE |
2,050 |
|
Datasheet |
APO | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
|
ICA-314-SGG-L.100" SCREW MACHINE DIP SOCKET |
4,209 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
|
116-83-632-41-009101CONN IC DIP SOCKET 32POS GOLD |
3,891 |
|
Datasheet |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
22-16-4CONN TRANSIST TO-5 4POS GOLD |
4,831 |
|
- |
22 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | - | Gold | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
21-0518-11HCONN SOCKET SIP 21POS GOLD |
4,477 |
|
Datasheet |
518 | Bulk | Active | SIP | 21 (1 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
117-83-664-41-005101CONN IC DIP SOCKET 64POS GOLD |
2,895 |
|
Datasheet |
117 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 64 (2 x 32) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
10-9513-11CONN IC DIP SOCKET 10POS GOLD |
2,044 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
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