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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    22-4518-10M

    22-4518-10M

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 4,244
    RFQ
    		22-4518-10M

    Datasheet

         		518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-83-648-41-001101

    612-83-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    		 3,604
    RFQ
    		612-83-648-41-001101

    Datasheet

         		612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0120-TT-12

    HLS-0120-TT-12

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,289
    RFQ
    		HLS-0120-TT-12

    Datasheet

         		HLS Tube Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    116-87-640-41-002101

    116-87-640-41-002101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    		 3,633
    RFQ
    		116-87-640-41-002101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-308-ZMGG

    ICO-308-ZMGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,296
    RFQ
    		ICO-308-ZMGG

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-87-652-41-012101

    116-87-652-41-012101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    		 3,585
    RFQ
    		116-87-652-41-012101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-SST-L

    ICA-624-SST-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 3,034
    RFQ
    		ICA-624-SST-L

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-324-SST-L

    ICA-324-SST-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 2,417
    RFQ
    		ICA-324-SST-L

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    ICO-324-SST-L

    ICO-324-SST-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 3,984
    RFQ
    		ICO-324-SST-L

    Datasheet

         		ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    14-0517-90C

    14-0517-90C

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    		 4,666
    RFQ
    		14-0517-90C

    Datasheet

         		0517 Bulk Active SIP 14 (1 x 14) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-145-13-041101

    510-87-145-13-041101

    CONN SOCKET PGA 145POS GOLD

    Preci-Dip

    		 3,379
    RFQ
    		510-87-145-13-041101

    Datasheet

         		510 Bulk Active PGA 145 (13 x 13) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    12-3513-11H

    12-3513-11H

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 3,897
    RFQ
    		12-3513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-0518-11

    30-0518-11

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    		 4,349
    RFQ
    		30-0518-11

    Datasheet

         		518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    APO-318-T-A

    APO-318-T-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,050
    RFQ
    		APO-318-T-A

    Datasheet

         		APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICA-314-SGG-L

    ICA-314-SGG-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    		 4,209
    RFQ
    		ICA-314-SGG-L

    Datasheet

         		ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    116-83-632-41-009101

    116-83-632-41-009101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    		 3,891
    RFQ
    		116-83-632-41-009101

    Datasheet

         		116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    22-16-4

    22-16-4

    CONN TRANSIST TO-5 4POS GOLD

    Grayhill Inc.

    		 4,831
    RFQ

    -

    		 22 Bulk Obsolete Transistor, TO-5 4 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Thermoplastic, Glass Filled -
    21-0518-11H

    21-0518-11H

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    		 4,477
    RFQ
    		21-0518-11H

    Datasheet

         		518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    117-83-664-41-005101

    117-83-664-41-005101

    CONN IC DIP SOCKET 64POS GOLD

    Preci-Dip

    		 2,895
    RFQ
    		117-83-664-41-005101

    Datasheet

         		117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-9513-11

    10-9513-11

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 2,044
    RFQ
    		10-9513-11

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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