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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    06-2503-31

    06-2503-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    		 2,000
    RFQ
    		06-2503-31

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    12-6503-20

    12-6503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 3,784
    RFQ
    		12-6503-20

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6503-30

    12-6503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 4,915
    RFQ
    		12-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-0517-90C

    16-0517-90C

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    		 2,223
    RFQ
    		16-0517-90C

    Datasheet

         		0517 Bulk Active SIP 16 (1 x 16) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    13-0511-10

    13-0511-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    		 3,648
    RFQ
    		13-0511-10

    Datasheet

         		511 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6518-10H

    24-6518-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,167
    RFQ
    		24-6518-10H

    Datasheet

         		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-822-90E

    16-822-90E

    16 PIN RT ANGLE HORIZONTAL SOCKT

    Aries Electronics

    		 2,610
    RFQ

    -

    		 Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 105°C
    07-0501-20

    07-0501-20

    CONN SOCKET SIP 7POS TIN

    Aries Electronics

    		 4,412
    RFQ
    		07-0501-20

    Datasheet

         		501 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    07-0501-30

    07-0501-30

    CONN SOCKET SIP 7POS TIN

    Aries Electronics

    		 4,294
    RFQ
    		07-0501-30

    Datasheet

         		501 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-810-90T

    08-810-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    		 2,327
    RFQ
    		08-810-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
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