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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    06-2503-31

    06-2503-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,000
    RFQ
    06-2503-31

    Datasheet

    503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    12-6503-20

    12-6503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,784
    RFQ
    12-6503-20

    Datasheet

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    12-6503-30

    12-6503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    4,915
    RFQ
    12-6503-30

    Datasheet

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    16-0517-90C

    16-0517-90C

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    2,223
    RFQ
    16-0517-90C

    Datasheet

    0517 Bulk Active SIP 16 (1 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    13-0511-10

    13-0511-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    3,648
    RFQ
    13-0511-10

    Datasheet

    511 Bulk Active SIP 13 (1 x 13) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
    24-6518-10H

    24-6518-10H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,167
    RFQ
    24-6518-10H

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-822-90E

    16-822-90E

    16 PIN RT ANGLE HORIZONTAL SOCKT

    Aries Electronics

    2,610
    RFQ

    -

    Vertisockets™ 800 - Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) 105°C Tin Polyamide (PA46), Nylon 4/6 50.0µin (1.27µm) Phosphor Bronze
    07-0501-20

    07-0501-20

    CONN SOCKET SIP 7POS TIN

    Aries Electronics

    4,412
    RFQ
    07-0501-20

    Datasheet

    501 Bulk Active SIP 7 (1 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    07-0501-30

    07-0501-30

    CONN SOCKET SIP 7POS TIN

    Aries Electronics

    4,294
    RFQ
    07-0501-30

    Datasheet

    501 Bulk Active SIP 7 (1 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-810-90T

    08-810-90T

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    2,327
    RFQ
    08-810-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
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