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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    14-0511-10

    14-0511-10

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    		 2,603
    RFQ
    		14-0511-10

    Datasheet

         		511 Bulk Active SIP 14 (1 x 14) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
    15-0508-20

    15-0508-20

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    		 2,343
    RFQ
    		15-0508-20

    Datasheet

         		508 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    15-0508-30

    15-0508-30

    CONN SOCKET SIP 15POS GOLD

    Aries Electronics

    		 2,424
    RFQ
    		15-0508-30

    Datasheet

         		508 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    10-820-90C

    10-820-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,659
    RFQ
    		10-820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    10-822-90C

    10-822-90C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,387
    RFQ
    		10-822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    08-0503-21

    08-0503-21

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    		 4,477
    RFQ
    		08-0503-21

    Datasheet

         		0503 Bulk Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    08-0503-31

    08-0503-31

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    		 4,565
    RFQ
    		08-0503-31

    Datasheet

         		0503 Bulk Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    14-3518-10M

    14-3518-10M

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 4,393
    RFQ
    		14-3518-10M

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    20-3501-20

    20-3501-20

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    		 3,984
    RFQ
    		20-3501-20

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-3501-30

    20-3501-30

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    		 4,175
    RFQ
    		20-3501-30

    Datasheet

         		501 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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