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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    10-2823-90T

    10-2823-90T

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    		 0
    RFQ
    		10-2823-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    39-0518-11

    39-0518-11

    CONN SOCKET SIP 39POS GOLD

    Aries Electronics

    		 0
    RFQ
    		39-0518-11

    Datasheet

         		518 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-3518-111

    20-3518-111

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 0
    RFQ
    		20-3518-111

    Datasheet

         		518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    64-9518-10

    64-9518-10

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    		 0
    RFQ
    		64-9518-10

    Datasheet

         		518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-2823-90

    10-2823-90

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 0
    RFQ
    		10-2823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    14-822-90E

    14-822-90E

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    		 0
    RFQ
    		14-822-90E

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    26-0511-10

    26-0511-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    		 0
    RFQ
    		26-0511-10

    Datasheet

         		511 Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-20

    14-3508-20

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 0
    RFQ
    		14-3508-20

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-30

    14-3508-30

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 0
    RFQ
    		14-3508-30

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-81000-310C

    10-81000-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 0
    RFQ
    		10-81000-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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