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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    10-81070-310C

    10-81070-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,185
    RFQ
    10-81070-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-81250-310C

    10-81250-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,551
    RFQ
    10-81250-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8250-310C

    10-8250-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,199
    RFQ
    10-8250-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8270-310C

    10-8270-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,343
    RFQ
    10-8270-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8375-310C

    10-8375-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,116
    RFQ
    10-8375-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8575-310C

    10-8575-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,552
    RFQ
    10-8575-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8620-310C

    10-8620-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,415
    RFQ
    10-8620-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    10-8630-310C

    10-8630-310C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,415
    RFQ
    10-8630-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    06-0501-21

    06-0501-21

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    3,011
    RFQ
    06-0501-21

    Datasheet

    501 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    06-0501-31

    06-0501-31

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    2,063
    RFQ
    06-0501-31

    Datasheet

    501 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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