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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    08-2810-90

    08-2810-90

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    2,527
    RFQ
    08-2810-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    24-516-10

    24-516-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,838
    RFQ
    24-516-10

    Datasheet

    516 Bulk Obsolete DIP, ZIF (ZIP) 24 (2 x 12) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
    18-3511-11

    18-3511-11

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,363
    RFQ
    18-3511-11

    Datasheet

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    10-9503-20

    10-9503-20

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,043
    RFQ
    10-9503-20

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    10-9503-30

    10-9503-30

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,905
    RFQ
    10-9503-30

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    16-3508-20

    16-3508-20

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,396
    RFQ
    16-3508-20

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    16-3508-30

    16-3508-30

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,265
    RFQ
    16-3508-30

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    24-6513-11H

    24-6513-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,048
    RFQ
    24-6513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    28-C182-11

    28-C182-11

    DIP SOCKET

    Aries Electronics

    4,072
    RFQ

    -

    EJECT-A-DIP™ - Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    37-0511-10

    37-0511-10

    CONN SOCKET SIP 37POS TIN

    Aries Electronics

    4,051
    RFQ
    37-0511-10

    Datasheet

    511 Bulk Active SIP 37 (1 x 37) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
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