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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
11-0503-31CONN SOCKET SIP 11POS GOLD Aries Electronics |
2,339 |
|
Datasheet |
0503 | Bulk | Active | SIP | 11 (1 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Gold | Polyamide (PA), Nylon, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
39-0518-00CONN SOCKET SIP 39POS GOLD Aries Electronics |
3,450 |
|
Datasheet |
518 | Bulk | Active | SIP | 39 (1 x 39) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
14-820-90CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
2,234 |
|
Datasheet |
Vertisockets™ 800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
22-3513-11HCONN IC DIP SOCKET 22POS GOLD Aries Electronics |
3,727 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
17-0503-20CONN SOCKET SIP 17POS GOLD Aries Electronics |
2,182 |
|
Datasheet |
0503 | Bulk | Active | SIP | 17 (1 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
17-0503-30CONN SOCKET SIP 17POS GOLD Aries Electronics |
3,443 |
|
Datasheet |
0503 | Bulk | Active | SIP | 17 (1 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | - | Tin | Polyamide (PA), Nylon, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
38-0511-10CONN SOCKET SIP 38POS TIN Aries Electronics |
2,282 |
|
Datasheet |
511 | Bulk | Active | SIP | 38 (1 x 38) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 50.0µin (1.27µm) | Phosphor Bronze |
|
|
21-0508-20CONN SOCKET SIP 21POS GOLD Aries Electronics |
2,854 |
|
Datasheet |
508 | Bulk | Active | SIP | 21 (1 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
|
16-C280-11HCONN IC DIP SOCKET 16POS GOLD Aries Electronics |
3,825 |
|
Datasheet |
EJECT-A-DIP™ | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
28-3513-11CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,185 |
|
Datasheet |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
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