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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    20-0501-30

    20-0501-30

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    2,157
    RFQ
    20-0501-30

    Datasheet

    501 Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-0501-20

    20-0501-20

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    4,622
    RFQ
    20-0501-20

    Datasheet

    501 Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-6518-102

    40-6518-102

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,006
    RFQ
    40-6518-102

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    13-0503-21

    13-0503-21

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    3,863
    RFQ
    13-0503-21

    Datasheet

    0503 Bulk Active SIP 13 (1 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    13-0503-31

    13-0503-31

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    4,923
    RFQ
    13-0503-31

    Datasheet

    0503 Bulk Active SIP 13 (1 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    20-0503-30

    20-0503-30

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,021
    RFQ
    20-0503-30

    Datasheet

    0503 Bulk Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
    20-3518-01

    20-3518-01

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,342
    RFQ
    20-3518-01

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    20-4518-01

    20-4518-01

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,645
    RFQ
    20-4518-01

    Datasheet

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-C182-11

    24-C182-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,197
    RFQ
    24-C182-11

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-C300-11

    24-C300-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,051
    RFQ
    24-C300-11

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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