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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    18-3508-30

    18-3508-30

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,512
    RFQ
    18-3508-30

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-6501-21

    14-6501-21

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,786
    RFQ
    14-6501-21

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    14-6501-31

    14-6501-31

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,404
    RFQ
    14-6501-31

    Datasheet

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    28-3518-11H

    28-3518-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,101
    RFQ
    28-3518-11H

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    11-71000-10

    11-71000-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    4,052
    RFQ
    11-71000-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    11-7400-10

    11-7400-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    4,743
    RFQ
    11-7400-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    11-7587-10

    11-7587-10

    CONN SOCKET SIP 11POS TIN

    Aries Electronics

    3,556
    RFQ
    11-7587-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 11 (1 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    08-6621-30

    08-6621-30

    CONN IC DIP SOCKET 8POS TIN

    Aries Electronics

    4,553
    RFQ
    08-6621-30

    Datasheet

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    09-0501-30

    09-0501-30

    CONN SOCKET SIP 9POS TIN

    Aries Electronics

    4,097
    RFQ
    09-0501-30

    Datasheet

    501 Bulk Active SIP 9 (1 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    30-9513-11

    30-9513-11

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,657
    RFQ
    30-9513-11

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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