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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    30-6513-11H

    30-6513-11H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    2,310
    RFQ
    30-6513-11H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    20-6511-11

    20-6511-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    2,385
    RFQ
    20-6511-11

    Datasheet

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    10-9503-21

    10-9503-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,676
    RFQ
    10-9503-21

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    10-9503-31

    10-9503-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,057
    RFQ
    10-9503-31

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    26-1508-20

    26-1508-20

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    2,260
    RFQ
    26-1508-20

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    26-1508-30

    26-1508-30

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    3,128
    RFQ
    26-1508-30

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    16-0501-20

    16-0501-20

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    3,372
    RFQ
    16-0501-20

    Datasheet

    501 Bulk Active SIP 16 (1 x 16) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    16-0501-30

    16-0501-30

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    3,229
    RFQ
    16-0501-30

    Datasheet

    501 Bulk Active SIP 16 (1 x 16) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    05-7380-10

    05-7380-10

    CONN SOCKET SIP 5POS TIN

    Aries Electronics

    4,195
    RFQ
    05-7380-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    24-4518-11H

    24-4518-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,314
    RFQ
    24-4518-11H

    Datasheet

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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