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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-6513-11H

    30-6513-11H

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 2,310
    RFQ
    		30-6513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-6511-11

    20-6511-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 2,385
    RFQ
    		20-6511-11

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-9503-21

    10-9503-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,676
    RFQ
    		10-9503-21

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-9503-31

    10-9503-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,057
    RFQ
    		10-9503-31

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    26-1508-20

    26-1508-20

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 2,260
    RFQ
    		26-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    26-1508-30

    26-1508-30

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 3,128
    RFQ
    		26-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 26 (2 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-0501-20

    16-0501-20

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    		 3,372
    RFQ
    		16-0501-20

    Datasheet

         		501 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-0501-30

    16-0501-30

    CONN SOCKET SIP 16POS TIN

    Aries Electronics

    		 3,229
    RFQ
    		16-0501-30

    Datasheet

         		501 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    05-7380-10

    05-7380-10

    CONN SOCKET SIP 5POS TIN

    Aries Electronics

    		 4,195
    RFQ
    		05-7380-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-4518-11H

    24-4518-11H

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,314
    RFQ
    		24-4518-11H

    Datasheet

         		518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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