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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    28-1508-20

    28-1508-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,162
    RFQ
    28-1508-20

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    28-1508-30

    28-1508-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,325
    RFQ
    28-1508-30

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
    14-823-90TWR

    14-823-90TWR

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    2,704
    RFQ
    14-823-90TWR

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    48-6518-10M

    48-6518-10M

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,724
    RFQ
    48-6518-10M

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    22-6511-11

    22-6511-11

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,791
    RFQ
    22-6511-11

    Datasheet

    511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    16-810-90T

    16-810-90T

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    3,589
    RFQ
    16-810-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    50-9518-11

    50-9518-11

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,243
    RFQ
    50-9518-11

    Datasheet

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    16-820-90

    16-820-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,450
    RFQ
    16-820-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    16-810-90

    16-810-90

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,363
    RFQ
    16-810-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    13-7450-10

    13-7450-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    2,544
    RFQ
    13-7450-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 13 (1 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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