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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    14-7380-10

    14-7380-10

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    		 4,478
    RFQ
    		14-7380-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-7470-10

    14-7470-10

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    		 4,098
    RFQ
    		14-7470-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-7500-10

    14-7500-10

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    		 2,053
    RFQ
    		14-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-7750-10

    14-7750-10

    CONN SOCKET SIP 14POS TIN

    Aries Electronics

    		 4,975
    RFQ
    		14-7750-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-823-90C

    24-823-90C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 4,715
    RFQ
    		24-823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0501-21

    09-0501-21

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    		 3,648
    RFQ
    		09-0501-21

    Datasheet

         		501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    09-0501-31

    09-0501-31

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    		 2,097
    RFQ
    		09-0501-31

    Datasheet

         		501 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-2503-21

    10-2503-21

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,541
    RFQ
    		10-2503-21

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    10-2503-31

    10-2503-31

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,415
    RFQ
    		10-2503-31

    Datasheet

         		503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-9513-10H

    32-9513-10H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,449
    RFQ
    		32-9513-10H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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