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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    40-6513-11H

    40-6513-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 0
    RFQ
    		40-6513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6556-10

    24-6556-10

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 0
    RFQ
    		24-6556-10

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    18-820-90C

    18-820-90C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 0
    RFQ
    		18-820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-823-90C

    18-823-90C

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 0
    RFQ
    		18-823-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    15-0501-20

    15-0501-20

    CONN SOCKET SIP 15POS TIN

    Aries Electronics

    		 0
    RFQ
    		15-0501-20

    Datasheet

         		501 Bulk Active SIP 15 (1 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6503-20

    24-6503-20

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 0
    RFQ
    		24-6503-20

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6503-30

    24-6503-30

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 0
    RFQ
    		24-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0503-20

    21-0503-20

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    		 0
    RFQ
    		21-0503-20

    Datasheet

         		0503 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    21-0503-30

    21-0503-30

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    		 0
    RFQ
    		21-0503-30

    Datasheet

         		0503 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    22-0501-20

    22-0501-20

    CONN SOCKET SIP 22POS TIN

    Aries Electronics

    		 0
    RFQ
    		22-0501-20

    Datasheet

         		501 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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