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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    20-7490-11

    20-7490-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    		 2,501
    RFQ
    		20-7490-11

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-7600-11

    20-7600-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    		 3,798
    RFQ
    		20-7600-11

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    17-0503-21

    17-0503-21

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    		 2,891
    RFQ
    		17-0503-21

    Datasheet

         		0503 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    17-0503-31

    17-0503-31

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    		 2,938
    RFQ
    		17-0503-31

    Datasheet

         		0503 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-6823-90

    20-6823-90

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,019
    RFQ
    		20-6823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-6501-31

    16-6501-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,078
    RFQ
    		16-6501-31

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6501-30

    40-6501-30

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    		 4,868
    RFQ

    -

    		 501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-6501-20

    40-6501-20

    CONN IC DIP SOCKET 40POS TIN

    Aries Electronics

    		 4,104
    RFQ
    		40-6501-20

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-3513-11H

    28-3513-11H

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,704
    RFQ
    		28-3513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-810-90WR

    14-810-90WR

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 3,173
    RFQ
    		14-810-90WR

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
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