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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    28-6553-10

    28-6553-10

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    		 2,544
    RFQ
    		28-6553-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    17-0508-21

    17-0508-21

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    		 4,308
    RFQ
    		17-0508-21

    Datasheet

         		508 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    17-0508-31

    17-0508-31

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    		 2,907
    RFQ
    		17-0508-31

    Datasheet

         		508 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    09-0511-11

    09-0511-11

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    		 4,803
    RFQ
    		09-0511-11

    Datasheet

         		511 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    19-71080-10

    19-71080-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    		 4,772
    RFQ
    		19-71080-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    19-7375-10

    19-7375-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    		 3,752
    RFQ
    		19-7375-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    19-7400-10

    19-7400-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    		 2,442
    RFQ
    		19-7400-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    19-7650-10

    19-7650-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    		 4,959
    RFQ
    		19-7650-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    19-7750-10

    19-7750-10

    CONN SOCKET SIP 19POS TIN

    Aries Electronics

    		 3,463
    RFQ
    		19-7750-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 19 (1 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    20-81000-310C

    20-81000-310C

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,439
    RFQ
    		20-81000-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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