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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    21-7438-10

    21-7438-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    2,998
    RFQ
    21-7438-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    21-7530-10

    21-7530-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    3,387
    RFQ
    21-7530-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    21-7562-10

    21-7562-10

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    2,940
    RFQ
    21-7562-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 21 (1 x 21) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    22-6823-90

    22-6823-90

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,540
    RFQ
    22-6823-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    26-6823-90T

    26-6823-90T

    CONN IC DIP SOCKET 26POS TIN

    Aries Electronics

    4,883
    RFQ
    26-6823-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 26 (2 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    36-3513-10H

    36-3513-10H

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,762
    RFQ
    36-3513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    24-3570-10

    24-3570-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    4,411
    RFQ
    24-3570-10

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    24-6570-10

    24-6570-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    2,768
    RFQ
    24-6570-10

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6518-10E

    40-6518-10E

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,161
    RFQ
    40-6518-10E

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    18-0501-21

    18-0501-21

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    3,173
    RFQ
    18-0501-21

    Datasheet

    501 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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