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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    18-0501-31

    18-0501-31

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    		 2,295
    RFQ
    		18-0501-31

    Datasheet

         		501 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    32-6503-20

    32-6503-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,375
    RFQ
    		32-6503-20

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    32-6503-30

    32-6503-30

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,214
    RFQ
    		32-6503-30

    Datasheet

         		503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    32-PGM07002-10

    32-PGM07002-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,944
    RFQ
    		32-PGM07002-10

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    23-0503-20

    23-0503-20

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    		 3,305
    RFQ
    		23-0503-20

    Datasheet

         		0503 Bulk Active SIP 23 (1 x 23) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
    23-0503-30

    23-0503-30

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    		 2,974
    RFQ
    		23-0503-30

    Datasheet

         		0503 Bulk Active SIP 23 (1 x 23) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
    20-6810-90T

    20-6810-90T

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    		 2,308
    RFQ
    		20-6810-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    18-0508-21

    18-0508-21

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    		 4,195
    RFQ
    		18-0508-21

    Datasheet

         		508 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    18-0508-31

    18-0508-31

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    		 2,490
    RFQ
    		18-0508-31

    Datasheet

         		508 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    20-4508-30

    20-4508-30

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,494
    RFQ
    		20-4508-30

    Datasheet

         		508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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