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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    37-PGM10013-10

    37-PGM10013-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 2,685
    RFQ
    		37-PGM10013-10

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    30-6511-11

    30-6511-11

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 2,148
    RFQ
    		30-6511-11

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    11-0511-11

    11-0511-11

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    		 3,916
    RFQ
    		11-0511-11

    Datasheet

         		511 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    19-0501-21

    19-0501-21

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    		 2,134
    RFQ
    		19-0501-21

    Datasheet

         		501 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    16-6621-30

    16-6621-30

    CONN IC DIP SOCKET 16POS TIN

    Aries Electronics

    		 2,924
    RFQ
    		16-6621-30

    Datasheet

         		6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    26-3503-20

    26-3503-20

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 3,469
    RFQ
    		26-3503-20

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    26-3503-30

    26-3503-30

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 3,631
    RFQ
    		26-3503-30

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    24-3552-10

    24-3552-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 3,494
    RFQ
    		24-3552-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    24-3553-10

    24-3553-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 3,508
    RFQ
    		24-3553-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    24-6551-10

    24-6551-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,060
    RFQ
    		24-6551-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
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