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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    84-PGM13053-10

    84-PGM13053-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,745
    RFQ
    84-PGM13053-10

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    18-6810-90

    18-6810-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,236
    RFQ
    18-6810-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    22-81150-610C

    22-81150-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,135
    RFQ
    22-81150-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    22-81250-310C

    22-81250-310C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,968
    RFQ
    22-81250-310C

    Datasheet

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    22-81250-610C

    22-81250-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,437
    RFQ
    22-81250-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    22-8500-610C

    22-8500-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    3,280
    RFQ
    22-8500-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    22-8600-610C

    22-8600-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,091
    RFQ
    22-8600-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    22-8850-610C

    22-8850-610C

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,612
    RFQ
    22-8850-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    85-PGM11007-10

    85-PGM11007-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,721
    RFQ
    85-PGM11007-10

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    44-PGM08003-10

    44-PGM08003-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,845
    RFQ
    44-PGM08003-10

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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