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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    20-7550-10

    20-7550-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 0
    RFQ
    		20-7550-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7562-10

    20-7562-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 0
    RFQ
    		20-7562-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7570-10

    20-7570-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 0
    RFQ
    		20-7570-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7625-10

    20-7625-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 0
    RFQ
    		20-7625-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7629-10

    20-7629-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 0
    RFQ
    		20-7629-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7636-10

    20-7636-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 0
    RFQ
    		20-7636-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-822-90E

    18-822-90E

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    		 0
    RFQ
    		18-822-90E

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    21-0501-21

    21-0501-21

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    		 0
    RFQ
    		21-0501-21

    Datasheet

         		501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    21-0501-31

    21-0501-31

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    		 0
    RFQ
    		21-0501-31

    Datasheet

         		501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    50-9513-10H

    50-9513-10H

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    		 0
    RFQ
    		50-9513-10H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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