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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
28-3503-20CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,723 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
58-1518-00CONN IC DIP SOCKET 58POS GOLD Aries Electronics |
3,940 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 58 (2 x 29) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
18-81125-610CCONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,530 |
|
Datasheet |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
18-6503-31CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,555 |
|
Datasheet |
503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
|
38-0508-20CONN SOCKET SIP 38POS GOLD Aries Electronics |
4,288 |
|
Datasheet |
508 | Bulk | Active | SIP | 38 (1 x 38) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
38-0508-30CONN SOCKET SIP 38POS GOLD Aries Electronics |
2,775 |
|
Datasheet |
508 | Bulk | Active | SIP | 38 (1 x 38) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
38-1508-20CONN IC DIP SOCKET 38POS GOLD Aries Electronics |
2,012 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 38 (2 x 19) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
|
38-1508-30CONN IC DIP SOCKET 38POS GOLD Aries Electronics |
2,738 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 38 (2 x 19) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
|
27-0501-20CONN SOCKET SIP 27POS TIN Aries Electronics |
2,171 |
|
Datasheet |
501 | Bulk | Active | SIP | 27 (1 x 27) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
27-0501-30CONN SOCKET SIP 27POS TIN Aries Electronics |
4,125 |
|
Datasheet |
501 | Bulk | Active | SIP | 27 (1 x 27) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
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