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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    22-0501-21

    22-0501-21

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,496
    RFQ
    22-0501-21

    Datasheet

    501 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    22-0501-31

    22-0501-31

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,058
    RFQ
    22-0501-31

    Datasheet

    501 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    28-0501-20

    28-0501-20

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    2,806
    RFQ
    28-0501-20

    Datasheet

    501 Bulk Active SIP 28 (1 x 28) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    28-0501-30

    28-0501-30

    CONN SOCKET SIP 28POS TIN

    Aries Electronics

    2,855
    RFQ
    28-0501-30

    Datasheet

    501 Bulk Active SIP 28 (1 x 28) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    24-81000-610C

    24-81000-610C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,633
    RFQ
    24-81000-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-81150-610C

    24-81150-610C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,852
    RFQ
    24-81150-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-81250-610C

    24-81250-610C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,357
    RFQ
    24-81250-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-8250-610C

    24-8250-610C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    4,233
    RFQ
    24-8250-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-8312-610C

    24-8312-610C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,090
    RFQ
    24-8312-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-8370-610C

    24-8370-610C

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,753
    RFQ
    24-8370-610C

    Datasheet

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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