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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    34-3513-11H

    34-3513-11H

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    		 0
    RFQ
    		34-3513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-1508-20

    40-1508-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 0
    RFQ
    		40-1508-20

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    40-1508-30

    40-1508-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 0
    RFQ
    		40-1508-30

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    22-0501-30

    22-0501-30

    CONN SOCKET SIP 22POS TIN

    Aries Electronics

    		 0
    RFQ
    		22-0501-30

    Datasheet

         		501 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    13-0511-11

    13-0511-11

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    		 0
    RFQ
    		13-0511-11

    Datasheet

         		511 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-6621-30

    20-6621-30

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    		 0
    RFQ
    		20-6621-30

    Datasheet

         		6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-0511-11

    14-0511-11

    CONN SOCKET SIP 14POS GOLD

    Aries Electronics

    		 0
    RFQ
    		14-0511-11

    Datasheet

         		511 Bulk Active SIP 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    29-0501-20

    29-0501-20

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    		 0
    RFQ
    		29-0501-20

    Datasheet

         		501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    29-0501-30

    29-0501-30

    CONN SOCKET SIP 29POS TIN

    Aries Electronics

    		 0
    RFQ
    		29-0501-30

    Datasheet

         		501 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-516-11S

    24-516-11S

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 0
    RFQ
    		24-516-11S

    Datasheet

         		516 Bulk Active DIP, ZIF (ZIP) 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
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