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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    23-0501-21

    23-0501-21

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    3,583
    RFQ
    23-0501-21

    Datasheet

    501 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    23-0501-31

    23-0501-31

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    2,201
    RFQ
    23-0501-31

    Datasheet

    501 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    26-71250-10

    26-71250-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    4,257
    RFQ
    26-71250-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    26-7500-10

    26-7500-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    3,678
    RFQ
    26-7500-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    21-0508-21

    21-0508-21

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    4,054
    RFQ
    21-0508-21

    Datasheet

    508 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    16-C195-21

    16-C195-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    3,400
    RFQ
    16-C195-21

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    16-C195-31

    16-C195-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,839
    RFQ
    16-C195-31

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    16-C280-21

    16-C280-21

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    4,995
    RFQ
    16-C280-21

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    16-C280-31

    16-C280-31

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,454
    RFQ
    16-C280-31

    Datasheet

    EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    30-0501-20

    30-0501-20

    CONN SOCKET SIP 30POS TIN

    Aries Electronics

    4,814
    RFQ
    30-0501-20

    Datasheet

    501 Bulk Active SIP 30 (1 x 30) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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