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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    50-9518-10M

    50-9518-10M

    CONN IC DIP SOCKET 50POS GOLD

    Aries Electronics

    3,317
    RFQ
    50-9518-10M

    Datasheet

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    36-6556-30

    36-6556-30

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    3,839
    RFQ
    36-6556-30

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    64-9513-10H

    64-9513-10H

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,983
    RFQ
    64-9513-10H

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    28-6556-20

    28-6556-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,400
    RFQ
    28-6556-20

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    28-6556-30

    28-6556-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,048
    RFQ
    28-6556-30

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    19-0501-31

    19-0501-31

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    4,045
    RFQ
    19-0501-31

    Datasheet

    501 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    32-6823-90

    32-6823-90

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    2,656
    RFQ
    32-6823-90

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    48-6518-01

    48-6518-01

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    3,758
    RFQ
    48-6518-01

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    24-6556-20

    24-6556-20

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    3,315
    RFQ
    24-6556-20

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    24-6556-30

    24-6556-30

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,923
    RFQ
    24-6556-30

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
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