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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    24-3571-10

    24-3571-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,684
    RFQ
    		24-3571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3572-10

    24-3572-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,093
    RFQ
    		24-3572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3573-10

    24-3573-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 3,415
    RFQ
    		24-3573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-3574-10

    24-3574-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,794
    RFQ
    		24-3574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6571-10

    24-6571-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 4,728
    RFQ
    		24-6571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6572-10

    24-6572-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 4,256
    RFQ
    		24-6572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    24-6573-10

    24-6573-10

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,093
    RFQ
    		24-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-3574-10

    32-3574-10

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    		 3,041
    RFQ
    		32-3574-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    48-6518-10E

    48-6518-10E

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 2,555
    RFQ
    		48-6518-10E

    Datasheet

         		518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-3551-10

    40-3551-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 3,240
    RFQ
    		40-3551-10

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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