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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    38-6501-21

    38-6501-21

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    		 3,420
    RFQ
    		38-6501-21

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    38-6501-31

    38-6501-31

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    		 4,453
    RFQ
    		38-6501-31

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    18-3508-312

    18-3508-312

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 3,295
    RFQ
    		18-3508-312

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    36-6823-90

    36-6823-90

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 3,491
    RFQ
    		36-6823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
    32-0501-20

    32-0501-20

    CONN SOCKET SIP 32POS TIN

    Aries Electronics

    		 4,293
    RFQ
    		32-0501-20

    Datasheet

         		501 Bulk Active SIP 32 (1 x 32) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    28-6621-30

    28-6621-30

    CONN IC DIP SOCKET 28POS TIN

    Aries Electronics

    		 3,015
    RFQ
    		28-6621-30

    Datasheet

         		6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    22-0508-21

    22-0508-21

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    		 2,680
    RFQ
    		22-0508-21

    Datasheet

         		508 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    22-0508-31

    22-0508-31

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    		 3,167
    RFQ
    		22-0508-31

    Datasheet

         		508 Bulk Active SIP 22 (1 x 22) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    22-1508-21

    22-1508-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 2,794
    RFQ
    		22-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    22-1508-31

    22-1508-31

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 2,469
    RFQ
    		22-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
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