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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    30-8563-610C

    30-8563-610C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 4,844
    RFQ
    		30-8563-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-8940-310C

    30-8940-310C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 3,848
    RFQ
    		30-8940-310C

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    30-8950-610C

    30-8950-610C

    CONN IC DIP SOCKET 30POS GOLD

    Aries Electronics

    		 2,711
    RFQ
    		30-8950-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    35-71000-10

    35-71000-10

    CONN SOCKET SIP 35POS TIN

    Aries Electronics

    		 4,785
    RFQ
    		35-71000-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    35-7360-10

    35-7360-10

    CONN SOCKET SIP 35POS TIN

    Aries Electronics

    		 4,795
    RFQ
    		35-7360-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-820-90C

    40-820-90C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 2,634
    RFQ
    		40-820-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-822-90C

    40-822-90C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,083
    RFQ
    		40-822-90C

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-9503-20

    32-9503-20

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,695
    RFQ
    		32-9503-20

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    36-6556-11

    36-6556-11

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 3,760
    RFQ
    		36-6556-11

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    22-0503-21

    22-0503-21

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    		 4,355
    RFQ
    		22-0503-21

    Datasheet

         		0503 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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