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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    20-9503-21

    20-9503-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 3,957
    RFQ
    		20-9503-21

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-9503-31

    20-9503-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 4,745
    RFQ
    		20-9503-31

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    25-0503-31

    25-0503-31

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 2,644
    RFQ
    		25-0503-31

    Datasheet

         		0503 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    18-3508-311

    18-3508-311

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 4,226
    RFQ
    		18-3508-311

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-810-90T

    18-810-90T

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    		 4,322
    RFQ
    		18-810-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    27-0501-31

    27-0501-31

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    		 3,902
    RFQ
    		27-0501-31

    Datasheet

         		501 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-0501-20

    36-0501-20

    CONN SOCKET SIP 36POS TIN

    Aries Electronics

    		 3,731
    RFQ
    		36-0501-20

    Datasheet

         		501 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-7590-10

    26-7590-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    		 2,549
    RFQ
    		26-7590-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    26-7650-10

    26-7650-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    		 4,903
    RFQ
    		26-7650-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    22-3503-21

    22-3503-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 4,678
    RFQ
    		22-3503-21

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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