Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    20-9503-21

    20-9503-21

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,957
    RFQ
    20-9503-21

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    20-9503-31

    20-9503-31

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,745
    RFQ
    20-9503-31

    Datasheet

    503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    25-0503-31

    25-0503-31

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    2,644
    RFQ
    25-0503-31

    Datasheet

    0503 Bulk Active SIP 25 (1 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    18-3508-311

    18-3508-311

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,226
    RFQ
    18-3508-311

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    18-810-90T

    18-810-90T

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    4,322
    RFQ
    18-810-90T

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
    27-0501-31

    27-0501-31

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    3,902
    RFQ
    27-0501-31

    Datasheet

    501 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    36-0501-20

    36-0501-20

    CONN SOCKET SIP 36POS TIN

    Aries Electronics

    3,731
    RFQ
    36-0501-20

    Datasheet

    501 Bulk Active SIP 36 (1 x 36) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    26-7590-10

    26-7590-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    2,549
    RFQ
    26-7590-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    26-7650-10

    26-7650-10

    CONN SOCKET SIP 26POS TIN

    Aries Electronics

    4,903
    RFQ
    26-7650-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 26 (1 x 26) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    22-3503-21

    22-3503-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    4,678
    RFQ
    22-3503-21

    Datasheet

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    Total 4131 Record«Prev1... 277278279280281282283284...414Next»
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

    KATY Electronic Technology Co., LTD

    PRODUCT

    KATY Electronic Technology Co., LTD

    PHONE

    KATY Electronic Technology Co., LTD

    USER