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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    34-71130-10

    34-71130-10

    CONN SOCKET SIP 34POS TIN

    Aries Electronics

    		 4,669
    RFQ
    		34-71130-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    34-71250-10

    34-71250-10

    CONN SOCKET SIP 34POS TIN

    Aries Electronics

    		 2,797
    RFQ
    		34-71250-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    34-7500-10

    34-7500-10

    CONN SOCKET SIP 34POS TIN

    Aries Electronics

    		 3,981
    RFQ
    		34-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 34 (1 x 34) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    28-3570-10

    28-3570-10

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    		 2,204
    RFQ
    		28-3570-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    26-0501-21

    26-0501-21

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    		 4,248
    RFQ
    		26-0501-21

    Datasheet

         		501 Bulk Active SIP 26 (1 x 26) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    26-0501-31

    26-0501-31

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    		 2,412
    RFQ
    		26-0501-31

    Datasheet

         		501 Bulk Active SIP 26 (1 x 26) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    24-6556-11

    24-6556-11

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 3,321
    RFQ
    		24-6556-11

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
    36-6501-21

    36-6501-21

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 3,766
    RFQ
    		36-6501-21

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    36-6501-31

    36-6501-31

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 3,823
    RFQ
    		36-6501-31

    Datasheet

         		501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
    22-4503-31

    22-4503-31

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 2,243
    RFQ
    		22-4503-31

    Datasheet

         		503 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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