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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    24-0508-31

    24-0508-31

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,287
    RFQ
    24-0508-31

    Datasheet

    508 Bulk Active SIP 24 (1 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    24-1508-31

    24-1508-31

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,708
    RFQ
    24-1508-31

    Datasheet

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    21-0503-21

    21-0503-21

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    2,535
    RFQ
    21-0503-21

    Datasheet

    0503 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    21-0503-31

    21-0503-31

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,068
    RFQ
    21-0503-31

    Datasheet

    0503 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
    38-6820-90C

    38-6820-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,383
    RFQ
    38-6820-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    38-6822-90C

    38-6822-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,013
    RFQ
    38-6822-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    38-6823-90C

    38-6823-90C

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    4,917
    RFQ
    38-6823-90C

    Datasheet

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    14-3508-212

    14-3508-212

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,289
    RFQ
    14-3508-212

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    14-3508-312

    14-3508-312

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    3,328
    RFQ
    14-3508-312

    Datasheet

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    100-PGM13061-10

    100-PGM13061-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    4,933
    RFQ
    100-PGM13061-10

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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