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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    27-7530-10

    27-7530-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    2,463
    RFQ
    27-7530-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    27-7550-10

    27-7550-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    3,472
    RFQ
    27-7550-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    27-7650-10

    27-7650-10

    CONN SOCKET SIP 27POS TIN

    Aries Electronics

    4,971
    RFQ
    27-7650-10

    Datasheet

    700 Elevator Strip-Line™ Bulk Active SIP 27 (1 x 27) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-6508-302

    40-6508-302

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,655
    RFQ
    40-6508-302

    Datasheet

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    42-6554-10

    42-6554-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    4,602
    RFQ
    42-6554-10

    Datasheet

    55 Tray Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    42-3552-10

    42-3552-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    3,143
    RFQ
    42-3552-10

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    42-3553-10

    42-3553-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    2,907
    RFQ
    42-3553-10

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    42-6552-10

    42-6552-10

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    3,107
    RFQ
    42-6552-10

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    42-6553-10

    42-6553-10

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    4,817
    RFQ
    42-6553-10

    Datasheet

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    108-PGM12005-10

    108-PGM12005-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,761
    RFQ
    108-PGM12005-10

    Datasheet

    PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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