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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    40-9503-20

    40-9503-20

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,346
    RFQ
    		40-9503-20

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-9503-30

    40-9503-30

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,031
    RFQ
    		40-9503-30

    Datasheet

         		503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    18-3508-212

    18-3508-212

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 2,115
    RFQ
    		18-3508-212

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    40-9513-11H

    40-9513-11H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 4,930
    RFQ
    		40-9513-11H

    Datasheet

         		Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    31-7400-10

    31-7400-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    		 4,920
    RFQ
    		31-7400-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    31-7440-10

    31-7440-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    		 4,839
    RFQ
    		31-7440-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    31-7500-10

    31-7500-10

    CONN SOCKET SIP 31POS TIN

    Aries Electronics

    		 4,437
    RFQ
    		31-7500-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 31 (1 x 31) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    16-3508-212

    16-3508-212

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,665
    RFQ
    		16-3508-212

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    16-3508-312

    16-3508-312

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 4,017
    RFQ
    		16-3508-312

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    42-6556-30

    42-6556-30

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    		 4,374
    RFQ
    		42-6556-30

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
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