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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    26-0508-21

    26-0508-21

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    		 4,739
    RFQ
    		26-0508-21

    Datasheet

         		508 Bulk Active SIP 26 (1 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    26-0508-31

    26-0508-31

    CONN SOCKET SIP 26POS GOLD

    Aries Electronics

    		 2,875
    RFQ
    		26-0508-31

    Datasheet

         		508 Bulk Active SIP 26 (1 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
    120-PGM13015-10

    120-PGM13015-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,161
    RFQ
    		120-PGM13015-10

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    36-6556-20

    36-6556-20

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    		 4,177
    RFQ
    		36-6556-20

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
    30-6621-30

    30-6621-30

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    		 3,403
    RFQ
    		30-6621-30

    Datasheet

         		6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-7950-10

    40-7950-10

    CONN SOCKET SIP 40POS TIN

    Aries Electronics

    		 2,482
    RFQ
    		40-7950-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 40 (1 x 40) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
    40-3575-10

    40-3575-10

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,141
    RFQ
    		40-3575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    40-6571-10

    40-6571-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 4,709
    RFQ
    		40-6571-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6573-10

    40-6573-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 3,120
    RFQ
    		40-6573-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6575-10

    40-6575-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 2,476
    RFQ
    		40-6575-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
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