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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    40-6572-10

    40-6572-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 2,450
    RFQ
    		40-6572-10

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    22-4503-21

    22-4503-21

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 2,516
    RFQ
    		22-4503-21

    Datasheet

         		503 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-0508-21

    24-0508-21

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    		 4,279
    RFQ
    		24-0508-21

    Datasheet

         		508 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    24-1508-21

    24-1508-21

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 2,846
    RFQ
    		24-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    34-81150-610C

    34-81150-610C

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    		 4,434
    RFQ
    		34-81150-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-81250-610C

    34-81250-610C

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    		 3,983
    RFQ
    		34-81250-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-0508-21

    28-0508-21

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    		 2,159
    RFQ
    		28-0508-21

    Datasheet

         		508 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    28-0508-31

    28-0508-31

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    		 3,815
    RFQ
    		28-0508-31

    Datasheet

         		508 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    28-1508-21

    28-1508-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,598
    RFQ
    		28-1508-21

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    28-1508-31

    28-1508-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 3,544
    RFQ
    		28-1508-31

    Datasheet

         		508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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