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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    38-6823-90T

    38-6823-90T

    CONN IC DIP SOCKET 38POS TIN

    Aries Electronics

    		 3,870
    RFQ
    		38-6823-90T

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    25-0511-11

    25-0511-11

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    		 4,473
    RFQ
    		25-0511-11

    Datasheet

         		511 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    27-0501-21

    27-0501-21

    CONN SOCKET SIP 27POS GOLD

    Aries Electronics

    		 2,767
    RFQ
    		27-0501-21

    Datasheet

         		501 Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-0501-30

    36-0501-30

    CONN SOCKET SIP 36POS TIN

    Aries Electronics

    		 2,316
    RFQ
    		36-0501-30

    Datasheet

         		501 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-516-11S

    40-516-11S

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 2,724
    RFQ
    		40-516-11S

    Datasheet

         		516 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-3508-21

    18-3508-21

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 4,466
    RFQ
    		18-3508-21

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    18-3508-31

    18-3508-31

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    		 4,831
    RFQ
    		18-3508-31

    Datasheet

         		508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    65-PGM10008-11

    65-PGM10008-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 4,179
    RFQ
    		65-PGM10008-11

    Datasheet

         		PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-C182-20

    28-C182-20

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 2,131
    RFQ
    		28-C182-20

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C182-30

    28-C182-30

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 4,304
    RFQ
    		28-C182-30

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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