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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    42-6572-16

    42-6572-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6573-16

    42-6573-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    42-6575-16

    42-6575-16

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 0
    RFQ
    		42-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    68-536-11

    68-536-11

    CONN SOCKET PLCC ZIF 68POS GOLD

    Aries Electronics

    		 0
    RFQ

    -

    		 536 - Obsolete PLCC, ZIF (ZIP) 68 (4 x 17) 0.050" (1.27mm) Gold 12.0µin (0.30µm) - Through Hole Open Frame - - - - - - -
    36-3571-16

    36-3571-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 0
    RFQ
    		36-3571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    36-3572-16

    36-3572-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 0
    RFQ
    		36-3572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    36-3573-16

    36-3573-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 0
    RFQ
    		36-3573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    36-3574-16

    36-3574-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 0
    RFQ
    		36-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-3575-16

    36-3575-16

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 0
    RFQ
    		36-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6571-16

    36-6571-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 0
    RFQ
    		36-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    Total 4131 Record«Prev1... 372373374375376377378379...414Next»
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