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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
69-PLS11031-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
4,821 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
69-PLS13112-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
4,733 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
69-PRS11031-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
4,203 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
69-PRS11055-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
4,815 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
69-PRS13112-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,463 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
20-PLS13120-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,982 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
20-PRS13120-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
3,285 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
36-3553-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
2,479 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
|
|
36-6551-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
3,544 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
|
|
36-6552-16CONN IC DIP SOCKET ZIF 36POS Aries Electronics |
2,279 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
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