Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    64-9508-21

    64-9508-21

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    2,649
    RFQ
    64-9508-21

    Datasheet

    508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    64-9508-31

    64-9508-31

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    3,834
    RFQ
    64-9508-31

    Datasheet

    508 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    169-PGM13001-51

    169-PGM13001-51

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,221
    RFQ
    169-PGM13001-51

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    36-3570-16

    36-3570-16

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    4,358
    RFQ
    36-3570-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    44-6556-40

    44-6556-40

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    3,089
    RFQ
    44-6556-40

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    40-6556-41

    40-6556-41

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    2,035
    RFQ
    40-6556-41

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    32-3575-16

    32-3575-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    3,113
    RFQ
    32-3575-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    179-PGM15011-10H

    179-PGM15011-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    3,097
    RFQ
    179-PGM15011-10H

    Datasheet

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6575-16

    32-6575-16

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    4,636
    RFQ
    32-6575-16

    Datasheet

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    48-6556-40

    48-6556-40

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    4,874
    RFQ
    48-6556-40

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    Total 4131 Record«Prev1... 366367368369370371372373...414Next»
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

    KATY Electronic Technology Co., LTD

    PRODUCT

    KATY Electronic Technology Co., LTD

    PHONE

    KATY Electronic Technology Co., LTD

    USER