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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    40-6570-16

    40-6570-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,482
    RFQ
    		40-6570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    40-6571-16

    40-6571-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,747
    RFQ
    		40-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
    40-6572-16

    40-6572-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 2,287
    RFQ
    		40-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6573-16

    40-6573-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 4,198
    RFQ
    		40-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    40-6575-16

    40-6575-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 3,126
    RFQ
    		40-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    42-6556-41

    42-6556-41

    CONN IC DIP SOCKET 42POS GOLD

    Aries Electronics

    		 2,965
    RFQ
    		42-6556-41

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder Cup 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
    65-PRS10008-12

    65-PRS10008-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 3,524
    RFQ
    		65-PRS10008-12

    Datasheet

         		PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    66-PLS11054-12

    66-PLS11054-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 3,726
    RFQ
    		66-PLS11054-12

    Datasheet

         		PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    68-PLS11033-12

    68-PLS11033-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 3,920
    RFQ
    		68-PLS11033-12

    Datasheet

         		PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
    42-3554-16

    42-3554-16

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 4,791
    RFQ
    		42-3554-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Copper
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