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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
02-0508-31CONN SOCKET SIP 2POS GOLD Aries Electronics |
3,579 |
|
Datasheet |
508 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
02-1508-21CONN IC DIP SOCKET 2POS GOLD Aries Electronics |
3,419 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
|
02-1508-31CONN IC DIP SOCKET 2POS GOLD Aries Electronics |
4,357 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 2 (1 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6 | 10.0µin (0.25µm) | Brass |
|
C8140-04CONN IC DIP SOCKET 40POS TIN Aries Electronics |
4,472 |
|
Datasheet |
Edge-Grip™, C81 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
|
17-0513-10TCONN SOCKET SIP 17POS GOLD Aries Electronics |
3,947 |
|
Datasheet |
0513 | Bulk | Active | SIP | 17 (1 x 17) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
20-1518-10TCONN IC DIP SOCKET 20POS GOLD Aries Electronics |
4,318 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
22-1518-10CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
4,750 |
|
Datasheet |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
|
06-0513-11HCONN SOCKET SIP 6POS GOLD Aries Electronics |
2,795 |
|
Datasheet |
0513 | Bulk | Active | SIP | 6 (1 x 6) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
04-0508-30CONN SOCKET SIP 4POS GOLD Aries Electronics |
3,727 |
|
Datasheet |
508 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | - | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
|
|
04-1508-30CONN IC DIP SOCKET 4POS GOLD Aries Electronics |
2,250 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 4 (2 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6 | 200.0µin (5.08µm) | Brass |
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