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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    14-3518-00

    14-3518-00

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    4,063
    RFQ
    14-3518-00

    Datasheet

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    09-0518-11H

    09-0518-11H

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    2,369
    RFQ
    09-0518-11H

    Datasheet

    518 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    21-0518-10T

    21-0518-10T

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,657
    RFQ
    21-0518-10T

    Datasheet

    518 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0518-10

    23-0518-10

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    3,177
    RFQ
    23-0518-10

    Datasheet

    518 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    10-6513-10

    10-6513-10

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    2,134
    RFQ
    10-6513-10

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-3513-10T

    18-3513-10T

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    4,925
    RFQ
    18-3513-10T

    Datasheet

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6518-10T

    32-6518-10T

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    3,915
    RFQ
    32-6518-10T

    Datasheet

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-0513-10T

    18-0513-10T

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,517
    RFQ
    18-0513-10T

    Datasheet

    0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    03-0503-21

    03-0503-21

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    2,692
    RFQ
    03-0503-21

    Datasheet

    0503 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
    03-0503-31

    03-0503-31

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    3,909
    RFQ
    03-0503-31

    Datasheet

    0503 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled -
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