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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
24-3552-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
2,840 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
24-3553-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
4,072 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
24-6551-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
3,838 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
24-6552-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
4,974 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
24-6553-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
2,355 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
24-3554-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
3,855 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
24-6554-18CONN IC DIP SOCKET ZIF 24POS Aries Electronics |
4,210 |
|
- |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 250°C | Nickel Boron | Polyetheretherketone (PEEK), Glass Filled | 50.0µin (1.27µm) | Beryllium Nickel |
|
|
108-PLS12024-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
4,382 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
108-PRS12024-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,838 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
|
|
108-PRS13129-12CONN SOCKET PGA ZIF GOLD Aries Electronics |
2,043 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | Beryllium Copper |
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